产品规格:
- Material: FR4 PCB
- Layer count: 2 layers
- Board thickness: 1.6mm
- Finish copper thickness: 1.0 oz
- Surface treatment: LF HAL, peelable mask
Max.: 3.5mm
Min.: 0.7mm
Diameter of hole with
peelable mask
Diameter of Pad with
peelable mask
Min.: 0.25mm
Thickness of peelable
solder mask
Min.: 0.13mm
Space between peelable mask
and opening bonding Pad
Min.: 0.5mm
电路板制作流程图:
