产品规格:
- 材质: FR4 TG170
-
层数: 10层
- 板厚: 1.6mm
- 完成铜厚: 1.0 oz
- 表面处理: 沉金 2U''
- 应用: 工业控制
0.004"(0.1mm)(1/1
OZ) (Without copper foil)
1/2OZ (0.017mm)
2 Layers：0.016"(0.4mm)
4 Layers：0.020"(0.5mm)
6 Layers：0.028"(0.7mm)
Finished board
thickness tolerance
Finished board
thickness tolerance
Dielectric of inner laye
(min.)
0.002" (0.05mm)
Thin core thickness (min.)
Base copper thickness of
outer layer(min.)
Base copper thickness of
outer layer(max.)
3 OZ (0.105mm)
Base copper thickness
of inner layer(min.)
1/3 OZ (0.012mm)
Base copper thickness of inner layer(max.)
3 OZ (0.105mm)
Finished board size(max.)
20"*24"
(508mm*609mm)
Finished board size(min.)
2.756"*2.756"
(70mm*70mm)
Finished board
thickness(max.)
157.48" (4.0mm)
Finished board
thickness(min.)
±3mil (±0.076mm)
±2mil (±0.05mm)
电路板制作流程图:
