产品规格:
- 材质: FR4
- 层数: 6层
- 板厚: 1.6mm
- 完成铜厚: 1.0 oz
- 表面处理: 沉金
- 应用: 消费电子
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Solder mask opening space between Gold finger and solder Pad (min.) |
8mil (0.2mm)
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Plating Gold thickness of Gold finger (max.) |
Nickel:≥200u"(5.08um)
Gold:≥30u"(0.762um)
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Plating Gold thickness of Gold finger (min.) |
NICKEL:≥100u''(2.54um)
GOLD:≥5u"(0.127um)
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Space between gold finger and Tab (min.) |
3.4mm |
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Bevel edge height of Gold finger (Angle：20°) (max.) |
T=1.6mm: 2.2mm
T=1.2mm: 1.65mm
T=1.0mm: 1.37mm
T=0.8mm: 1.1mm
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Bevel edge height of Gold finger (Angle：30°) (max.) |
T=1.6mm: 1.39mm
T=1.2mm: 1.04mm
T=1.0mm: 0.87mm
T=0.8mm: 0.7mm
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Bevel edge height of Gold finger (Angle：45°) (max.) |
T=1.6mm: 0.8mm
T=1.2mm: 0.6mm
T=1.0mm: 0.5mm
T=0.8mm: 0.4mm
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Bevel edge height of Gold finger (Angle：60°) (max.) |
T=1.6mm: 0.46mm
T=1.2mm: 0.35mm
T=1.0mm: 0.29mm
T=0.8mm: 0.23mm
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Tolerance of Bevel edge angle of Gold finger |
±5°, ±3° |
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Tolerance of Bevel edge height of Gold finger |
＜30°：7mil(0.178mm)
≥30°：5mil(0.127mm)
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Thickness of peelable mask on Gold finger |
0.2-0.4mm |
电路板制作流程图:
